iesy ESP32 OSM-0F

iesy ESP32 OSM-0F

Solder-on module

The smallest solder-on module from the OSM™ series is smaller than a standard stamp. The area of application is therefore clear - small for small. The focus here is primarily on various applications from the consumer electronics environment. But the “dwarf” also has its right to exist for tasks in the industrial environment. Despite its small size, the OSM™ Size-0 (Zero) does not have to hide.In terms of performance, it covers numerous core functions very well. In addition, the Size-0, like all Open Standard Modules™, offers the possibility to respond flexibly to requirements. Since the SGeT e.V. specification is based on the open source idea, other board configurations and thus other functionalities and performance levels are possible and also desired. We are happy to answer your questions.


With its 15 mm x 30 mm, however, it is already a real all-rounder. It already offers numerous core functions that make the "iesy ESP32 OSM-0F" especially interesting for low space applications.

Technical Concept:

  • Microcontroller: ESP32 Xtensa DualCore x32 LX6

  • CPU Clock Rate: 240 MHz 

  • RAM: 512 KB

  • Flash-Memory: 32 Mbit SPI-Flash

  • Dimension: 15 mm x 30 mm

  • Footprint: OSM Size-0 
    Land Grid Array (LGA) with 188 contacts

  • Supply: 3,3 V, +/- 5 % via LGA contacts

  • Power consumption: <1 W (typ.) 

  • Temperature range:        
    > Operating: -40 °C to +80 °C
    > Storage: -40 °C to +85 °C    

  • Software: Espressif IDE (FreeRTOS based) via PlatformIO

Features & Interfaces

  • Wi-Fi 802.11 b/g/n + Bluetooth/BLE
  • 1 × LAN 10/100 (RMII), MAC compatible with IEEE 802.3
  • 1x OSM Antenna-Contact / U.FL-Connector (optionally)
  • 1x SDIO-Card
  • 1x I2C
  • 2x ADC
  • 4x GPIO, 2x UART, 1x SPI

Do you have any further questions or need a first quote? Our team will be happy to provide you with all the information you need. Please use the inquiry form below.