Processing modules for scalable embedded architectures
Computer Module / COM („Computer-on-Modules“) are the core of high-performance embedded systems – compact and scalable. They separate standardized compute modules from application-specific carrier boards. iesy develops and integrates COM solutions based on established form factors, combining deep system expertise with proven implementation skills. As an active member of the Standardization Group for Embedded Technologies (SGeT), we contribute our know-how directly to the advancement of established standards.
Module standards at a glance
- COM Express® – for high-performance x86 applications in harsh environments
- COM-HPC – for high-end computing power, high bandwidth, and future-proof interfaces
- SMARC™ – for energy-efficient ARM-based designs in a compact format
- Qseven® – for space-saving low-power applications with a high degree of integration
- OSM (Open Standard Module) – for ultra-compact solderable modules, suitable for fully automated assembly
iesy expertise
- Since 1994, iesy has been building on computer-on-modules, having developed more than 40 designs and integrated them into customer applications.
- We collaborate closely with leading module manufacturers, leverage extensive experience with modules of different performance classes, and guarantee reliable end-to-end solutions combining modules and carrier boards.
- iesy has direct access to manufacturer support and product management, aligning our designs with their roadmaps.
- We actively participate in international standardization bodies such as PICMG and SGeT. Martin Steger, iesy’s managing director and founding member of SGeT, also chairs the OSM standardization group (SDT.05).
