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Cooling

Efficient thermal management for maximum system stability

A well-designed cooling concept is essential for the stability and service life of embedded systems. Especially under high power density or extreme ambient temperatures, it prevents failures and ensures performance. iesy develops cooling solutions tailored to system design, environmental conditions, and industry-specific requirements.

Our standards at a glance

  • Passive cooling – silent, maintenance-free, vibration-proof
  • Active cooling – for systems with high power density
  • Heatpipe designs – efficient heat transfer in compact housings
  • Thermal interface materials (TIMs) – optimized heat dissipation between components
  • Simulation & validation – thermal design with proven safety

iesy Expertise

  • iesy customizes cooling solutions to project requirements – aligned with system specifications, installation conditions, environmental influences, and field of application.
  • We develop both active cooling systems with optimized fan and airflow design as well as passive concepts based on convection or heat dissipation through primary structures.
  • For high-performance electronics, we implement heatpipe and heat chamber systems that connect ICs as well as modern working and mass storage devices thermally and efficiently with external cooling solutions.

Additional context – concise and to the point.

INFO
BOX

Cooling Concepts Compared: When Passive, When Active?

Passive cooling systems operate without moving parts and are suitable for applications that demand silence, maintenance-free operation, and high reliability. They are ideal for systems with low to medium heat generation. Active cooling with fans becomes necessary when power density increases and natural convection is no longer sufficient. Standards such as IEC 60721 for environmental classifications and EMC guidelines influence the design and choice of cooling strategy.
Source: IEC, “IEC 60721-3-3: Classification of environmental conditions – stationary use, weather-protected locations”, accessed on September 29, 2025

Heatpipe Design for Efficient Heat Transfer

Heatpipes transfer heat particularly effectively over short and medium distances and are used in compact housings where airflow is not possible. They utilize phase-change technology to move heat from hotspots to cooling surfaces. The advantage: high thermal conductivity with minimal space requirements. Careful integration into the housing is essential to achieve maximum performance.
Source: IEEE, “Chapter 20: Thermal – IEEE Electronics Packaging Society”, accessed on September 29, 2025

Thermal Interface Materials (TIMs)

TIMs are thermal interface materials that reduce thermal resistance between electronic components and heat sinks. They compensate for surface irregularities and significantly improve heat transfer. Typical materials include thermal pastes, pads, or phase-change materials that ensure long-lasting contact and consistent heat dissipation.
Source: IEEE, “Chapter 20: Thermal – IEEE Electronics Packaging Society – Thermal Interface Materials”, accessed on September 29, 2025

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iesy GmbH
Darmcher Grund 22
58540 Meinerzhagen

Phone: +49 (2354) 70655 - 0
Fax: +49 (2354) 70655 - 25
Email: info(at)iesy.com

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