iesy GmbH

The solder-on modules of the Open Standard Modules™ series represent a sensible alternative. Especially with regard to flexibility and scalability, these can usually score thanks to their modular approach. Not to be neglected is the possibility of fully automatic assembly (SMT). This also has a positive effect on quality, as manual assembly steps are no longer necessary.

COM Express modules provide top performance and come in variable sizes in mini, compact, and basic form factors. The benefits of COM Express include scalability, flexibility and a general acceptance throughout the market. Together with our partners congatec and Kontron we offer COMe solutions, from rugged to high-end server module.

Qseven is a compact form factor (70 mm x 70 mm) for mobile and ultramobile embedded applications. Key benefits of the legacy-free Qseven standards are their compactness, small overall height, minimum power supply and suitability for systems with fanless cooling. Moreover, they enable the use of x86 and ARM architecture through a modular approach.

Thanks to their variety of interfaces and their consistent support of x86 and ARM architectures, SMARC 2.0 modules are particularly suited for projects that require long-term availability. Developed for use in rough industrial conditions, SMARC offers the ideal ratio of assembly space and feature set for mobile applications and solutions.

BeagleCore modules are small, affordable and ideal for use in industrial as well as professional consumer products. The open-source soldered modules present a key link between Maker boards and professional series production. Of stamp size, they combine key BeagleBone Black functionalities with comprehensive software compatibility.