News - Immer up to date mit iesy


In a nutshell: The latest information about our company, our projects and products. Learn what drives us. Videos, social media posts, scientific articles and many more: We keep you updated with new developments at iesy. If you require images, logos or interviews we’re happy to help you at

58 years iesy

Today we at iesy are celebrating our 58th company anniversary. Since our foundation, we have established ourselves as a specialist in embedded computing and have been developing hardware, software and system solutions that meet the highest standards.

Welcome to the team, Michelle Rebecchi

Michelle Rebecchi joined our team as Back Office & Administration Manager in March 2024.

iesy receives bronze status from EcoVadis for sustainability

We are pleased to announce that iesy has been awarded bronze status by EcoVadis for its sustainability practices. This recognition reflects our commitment to environmentally conscious design, ethical business behavior and social responsibility.

Welcome to the team, Björn Padberg

Since April 2024, Björn Padberg has joined our team as Chief Operating Officer (COO) and is part of the iesy management team as an authorized signatory. His main task is to ensure the operational business activities of our company.

iesy at the AFCEA 2024

Discover the diverse possibilities for secure embedded technologies at AFCEA in Bonn 2024 from June 26 to 27.

From high-security hardware components to customized embedded systems, we offer solutions that meet the most stringent security standards. Our technologies are designed to function reliably in the most demanding environments - whether in the defense industry, critical infrastructure or other security-relevant areas.

iesy AM62xx OSM-LF - a cost-effective SoM based on the AM62x from Texas Instruments

The AM62x Sitara™ MPU processors are designed for Linux applications®. Featuring the scalable ARM® Cortex-A53® and embedded features such as dual-display support and 3D graphics acceleration, as well as an extensive selection of peripherals, suitable for a wide range of industrial & automotive applications while providing intelligent features, and an optimized power architecture.  

OSM partnership launched with Mitwell Inc.

Since 2019, the challenges of miniaturization, scalability and cost efficiency in the embedded industry have never been greater. With the development of Open Standard Module as well as the goal to drive a uniform standardization of computer modules, iesy GmbH as a founding member has set itself the task to market OSM worldwide.

iesy & friends Newsletter Information about iesy at first hand
iesy & friends Newsletter

You want news at the very beginning? Then register for our iesy & friends newsletter. In this newsletter you will receive monthly updates on general & technical highlights as well as top news around iesy. Are you interested?

The iesy Repositories Clearly structured and easy to use

Our iesy repositories were developed with the aim to provide you with relevant documents, files and codes for our OSM products in a clearly arranged way. The iesy repositories are platforms on which content from the areas of hardware and software is made clearly accessible.

Product Development Blog - New

You can now get the latest information from product development via our Product Development Blog (PDB). Our focus is to provide you with relevant information on our computer modules in a timely manner. Developers and project managers in particular benefit from this service.

Specification 1.1 and Design Guide available Open Standard Module™

On the part of the Standardization Group for Embedded Technologies (SGET), two significant innovations were announced in May 2022 for the standard of solder modules introduced in 2019.

Thus, the new OSM specification 1.1 as well as the first design guide were presented. Our Managing Director Martin Steger, who is also Chairman of the Standard Development Team (SDT) at SGET, looks back on many months of hard work. The trend for OSM to establish itself as the world's first open, multi-vendor and scalable standard for solder modules continues to progress. The new specification 1.1 does justice to this rapid evolution of the OSM standard.

The new MXM product family from ADLINK

The challenge for graphics processors in terms of performance and size is increasing. The demand for their functionality in demanding or rough environments has also increased. With the launch of the new MXM product family, based on the NVIDIA Turing™ architecture, ADLINK is addressing this challenge. The embedded MXM graphics modules accelerate edge computing and edge AI applications to enable high-performance applications in the medical, robotics, transportation, aerospace and defense industries, among others.