7. June 2022
On the part of the Standardization Group for Embedded Technologies (SGET), two significant innovations were announced in May 2022 for the standard of solder modules introduced in 2019.
Thus, the new OSM specification 1.1 as well as the first design guide were presented. Our Managing Director Martin Steger, who is also Chairman of the Standard Development Team (SDT) at SGET, looks back on many months of hard work. The trend for OSM to establish itself as the world's first open, multi-vendor and scalable standard for solder modules continues to progress. The new specification 1.1 does justice to this rapid evolution of the OSM standard.