New standard for computer modules for Embedded Computing
As a specialist for customized embedded systems, we are presenting the first 3 modules of the new series of solder-on modules at the embedded world Digital, 1-5 March 2021.
Approximately one year ago, the specification for the Open Standard Modules™ - OSM™ - was adopted by the SGeT e.V. The new standard was developed to meet future requirements in terms of flexibility, scalability, but also costs.
In addition to a wide range of services, the new computer modules also offer new functionalities in terms of flexibility and processing. OSM™ solder-on modules can be individually adapted to the respective customer requirements. For this purpose, the individual modules can be made available to the SMT process using tray & reel packaging and processed automatically. The OSM™ series includes in total four different form factors.
At EW 2021 we are now presenting the first 3 modules for 2 form factors.
The "iesy ESP32 OSM-0F" (15x30 mm), the "iesy i.MX8M Mini OSM-SF" (30x30 mm) and the "iesy RPX30 OSM-SF" (30x30 mm).
With the current Size-S modules, iesy first uses an NXP®, and alternatively a Rockchip® processor. The Size-0 uses an ESP32 microcontroller. As usual at iesy, customer-specific developments are definitely welcome and can also be implemented.
For this purpose, the modules are already application-ready on the software side and equipped with all necessary drivers and BSPs. Thus, starting with the Size-S, an open source Linux based on Yocto is used. The data is made available via a Git repository and is thus available to every developer around the world. The goal here is to enable a high degree of transparency and to reduce handling costs to a minimum.
- Possibility for double-sided assembly
- 79 interfaces
- Additional 58 signal pins
- No Connectors
- Automatic processing
- Very small modules
- 100% Open Source
Please contact us for further information and data sheets. We would also be happy to introduce you to the associated EVA kit.