iesy APL OSM-LE
iesy APL OSM-LE
Solder-on module
With a size of 45 mm x 45 mm, the iesy APL OSM-LE is the first OSM form factor designed by Intel platform.
Technical Concept:
- Platform: Intel® Apollo Lake
- RAM: 4GB
- Dimension: 45 mm x 45 mm
- Footprint: OSM Size-L
Land Grid Array (LGA) with 662 contacts - Power-Supply: 5V via LGA contacts
- Software: Windows 10
- Temperature:
> Operating: 0 °C to +85 °C
> Storage: -40 °C to +85 °C
Features & Interfaces:
- 4x USB 2.0
- 2x USB 3.0
- 3x UART
- 8 GPIO
- 2x SPI
- 2x I2C
- 1x I2S
- 1x SDIO
- 1x JTAG
- 4x PWM
- 1x Camera Interface
- 3x PCI
- 1x eDP
Do you have any further questions or need a first quote? Our team will be happy to provide you with all the information you need. Please use the inquiry form below.