iesy APL OSM-LE

With a size of 45 mm x 45 mm, the iesy APL OSM-LE is the first OSM form factor designed by Intel platform.

Technical Concept:

• Platform: Intel® Apollo Lake
• RAM: 4GB
• Dimension: 45 mm x 45 mm
• Footprint: OSM Size-L
  Land Grid Array (LGA) with 662 contacts
• Power-Supply: 5V via LGA contacts
• Software: Windows 10
• Temperature:
  > Operating: 0 °C to +85 °C
  > Storage: -40 °C to +85 °C

Features & Interfaces:

• 4x USB 2.0
• 2x USB 3.0
• 3x UART
• 8 GPIO
• 2x SPI
• 2x I2C
• 1x I2S
• 1x SDIO
• 1x JTAG
• 4x PWM
• 1x Camera Interface
• 3x PCI
• 1x eDP

Do you have any further questions or need a first quote? Our team will be happy to provide you with all the information you need. Please use the inquiry form below.