iesy i.MX93 OSM-MF

With a size of 45 mm x 30 mm, the iesy i.MX93 OSM-MF enables the performance of fast, effective, cost-effective and, above all, secure edge applications. The scope of the application is different, so the Module can be used in areas such as the intelligent home, intelligent building, intelligent manufacturing, as well as in security systems, such as in the automotive sector.  

To comply with the requirements of an intelligent edge application, a heterogeneous multicore architecture is used during development. The principal components of the i.MX93 are the Dual Core A55 at 1.7 GHz and a real time Cortex-M33 microcontroller, which has access to all the SoC peripherals, such as the first integration within the sector of an Arm Ethos-U65 microNPU. 

Description 

With its 45 mm x 30 mm, however, it is already an all-rounder. It already offers numerous core functions that make the "iesy i.MX93 OSM-MF" interesting for applications in the industrial environment.

Technical Concept:

• Processor: i.MX9352 Dual-Core A55 with NPU + Cortex-M33 MCU
• CPU Clock-Rate: 1.7 GHz (A55) / 250 MHz (M33)
• RAM: 1 GByte LPDDR4 (Inline ECC)
• Flash-Memory: 8 GByte e-MMC 5.1
• Dimension: 30 mm x 45 mm
• Footprint: OSM Size-M Land Grid Array (LGA) with 476 contacts
• Supply: Single Supply 5 VDC
• Temperature range:
  > Operating: -25 °C to +85 °C
  > Storage: -40 °C to +85 °C
   
• Features & Interfaces
  > 2× Ethernet 1 Gbit (with TSN)
  > 2x USB 2.0 Client/Host/OTG
  > 1x MIPI CSI (2 Lanes, incl. I2C)
  > 1x MIPI-DSI (4 lanes) – Up to 1080p/60 FPS
  > 1x SD-Card + 1x SDIO (4 bit)
  > 15x GPIO
  > 2x CAN
  > 1x I2S
  > 2x I2C
  > 2x UART + 1x Debug-UART
  > 2x ADC-Input
  > 4x PWM, 1x JTAG, 1x SPI (2x chip select)

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