iesy EHL OSM-LE
iesy EHL OSM-LE
Solder-on module
With a size of 45 mm x 45 mm, the iesy EHL OSM-LE is the first OSM form factor designed by Intel platform.
Technical Concept:
- Platform: Intel® Elkhart Lake x6413E
- RAM: 4 GByte
- Flash-Memory: 64 GB eMMC (only for eMCP version)
- Dimension: 45 mm x 45 mm
- Footprint: OSM Size-L Land Grid Array (LGA) with 662 contacts
- Supply: 5V via LGA contacts
- Software: Windows / Yocto Linux
- Temperature range:
> Operating: 0 °C to +70 °C
> Storage: -40 °C to +85 °C
- Features & Interfaces
> 3x Ethernet 100M/1G (2x RGMII, 1x SGMII)
> 2x USB 2.0 Host
> 2x USB 3.0 Host with USB 2.0 support
> 4x UART (2x with RTS/CTS)
> 13x GPIO, 4x PWM
> 3x SPI (1x connected to BIOS & TPM)
> 2x I2C, 2x I2S
> 2x SDIO (1x 4 bit, 1x 8bit)
> 1x CAN (CAN-FD), 1x JTAG
> 2x PCIe x1
> 4x PCIe x1 / 2x PCIe x2 / 1x PCIe x4 / 1x PCIe x2 + 2x PCIe x1
> 2x PCIe x1 / 1x PCIe x2
> 1x eDP (4 lanes), 1x DP/HDMI (2 lanes)
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