iesy EHL OSM-LE

iesy EHL OSM-LE

Solder-on module

With a size of 45 mm x 45 mm, the iesy EHL OSM-LE is the first OSM form factor designed by Intel platform.

Technical Concept:

  • Platform: Intel® Elkhart Lake x6413E
  • RAM: 4 GByte
  • Flash-Memory: 64 GB eMMC (only for eMCP version)
  • Dimension: 45 mm x 45 mm
  • Footprint: OSM Size-L Land Grid Array (LGA) with 662 contacts
  • Supply: 5V via LGA contacts
  • Software: Windows / Yocto Linux
  • Temperature range:
    > Operating: 0 °C to +70 °C
    > Storage: -40 °C to +85 °C
     
  • Features & Interfaces
    > 3x Ethernet 100M/1G (2x RGMII, 1x SGMII)
    > 2x USB 2.0 Host
    > 2x USB 3.0 Host with USB 2.0 support
    > 4x UART (2x with RTS/CTS)
    > 13x GPIO, 4x PWM
    > 3x SPI (1x connected to BIOS & TPM)
    > 2x I2C, 2x I2S
    > 2x SDIO (1x 4 bit, 1x 8bit)
    > 1x CAN (CAN-FD), 1x JTAG
    > 2x PCIe x1
    > 4x PCIe x1 / 2x PCIe x2 / 1x PCIe x4 / 1x PCIe x2 + 2x PCIe x1
    > 2x PCIe x1 / 1x PCIe x2
    > 1x eDP (4 lanes), 1x DP/HDMI (2 lanes)

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